TSMC Celebrates 30th North America Technology Symposium with Innovations Powering AI with Silicon Leadership

SANTA CLARA, Calif.--(BUSINESS WIRE)--TSMC (TWSE: 2330, NYSE: TSM) today unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium. TSMC debuted the TSMC A16TM technology, featuring leading nanosheet transistors with innovative backside power rail solution for production in 2026, bringing greatly improved logic density and performance. T